semiconductor technology 結果共192筆

A fleet of 1,000 drones illuminated Taipei’s skyline, marking the start of COMPUTEX Taipei. The show celebrated Taiwan’s tech industry and innovation.

Taiwan court convicts four engineers in first National Security Act case for stealing TSMC chip secrets. Sentences range from 2 to 10 years.

Once Taiwan’s historic seat of government, the city of Tainan has undergone a dramatic transformation from a sleepy backwater of narrow old streets and vibrant temples into a thriving technology hub anchored by the Southern Taiwan Science Park (STSP). A record-shattering 2025, new advanced-process fab announcements, and a fast-tracked expansion at Shalun have cemented Tainan’s place at the heart of the global semiconductor supply chain.

At its 2026 North America Technology Symposium, TSMC unveiled a roadmap that highlights where the world’s largest contract chipmaker is placing its boldest bets and where it is choosing restraint.

For two decades, Taiwan’s technology map was defined by two dominant poles: the Hsinchu Science Park in the north and the Southern Taiwan Science Park around Tainan. The central region, long known for its precision-machinery firms and textile manufacturers, appeared to be a noticeable gap. The Central Taiwan Science Park (CTSP) was created precisely to fill that gap. In 2025 and 2026, it has attracted some of the largest semiconductor investments in Taiwan’s history.

Few industrial policies in modern history have delivered outsized returns like Taiwan’s science parks. What began as a bold experiment in clustering talent and technology amid the rice fields of Hsinchu has, over four decades, forged the physical and institutional backbone of the global semiconductor industry. In the process, it transformed Taiwan from a low-end textile and assembly economy into one of the world’s most strategically vital manufacturing hubs.

ASE Technology Holding (2311.TW) is the world’s largest outsourced semiconductor assembly and test company, commanding more than 30% of the global market. For four decades the Kaohsiung-based firm has performed the essential final steps of chipmaking: turning raw silicon wafers into functional, tested chips ready for deployment. As advanced packaging becomes the tightest bottleneck in the AI supply chain, ASE has moved from behind-the-scenes enabler to one of the most strategically important companies in global technology.

For years, Taiwan’s outsourced semiconductor assembly and test (OSAT) firms have operated quietly behind TSMC’s headlines. That era is over. As the AI buildout accelerates, advanced packaging has become the tightest chokepoint in the entire semiconductor supply chain, and Taiwan’s packaging and test companies have moved from back-office enablers to strategic kingmakers. The Q2 2026 outlook is defined by three realities: demand is outrunning capacity, the technology roadmap is moving faster than ever, and every major player is investing at record levels to keep up.

Taiwan’s technology sector first-quarter 2026 results send a clear message that the AI infrastructure boom is continuing to accelerate. Across every layer of the island’s tech ecosystem, companies are posting record numbers and committing unprecedented capital to expand capacity. The real story emerging from Q1 is not any single headline figure, but how much more central Taiwan has become to the world’s computing infratructure.

Touch Taiwan lacks the global profile of Computex. Running frm April 8 to 10 at the Taipei Nangang Exhibition Center, it remains a smaller event, traditionally attended mainly by industry insiders. This year, however, the show deserves broader attention, not only for its display technology, but for what the exhibitor mix, keynote themes, and expanding supply chain participation reveal about Taiwan’s technology sector.

Computex has long served as a barometer for the global technology industry. This year’s edition, running June 2–5 in Taipei under the banner “AI Together,” carries added weight. The first quarter of 2026 delivered a cascade of transformative developments: a landmark US-Taiwan trade agreement, hundreds of billions of dollars in new capital commitments, an intensifying supply crunch at the most advanced chip nodes, and the rise of Physical AI as the industry’s next organizing principle. Together, these shifts are realigning Taiwan’s technology economy. Computex is where these threads will converge in public.

National Taiwan University of Science and Technology and GPTC signed a NT$50 million deal to boost semiconductor research and talent development. The partnership focuses on equipment integration, material innovation, and offers scholarships and job opportunities for students.

Few companies in Taiwan’s technology ecosystem have reinvented themselves as thoroughly as Zhen Ding Technology. Originally established in 2006 as Foxconn Advanced Technology, a subsidiary making flexible circuits for consumer electronics, the company rebranded in 2011 and grew into the world’s largest PCB manufacturer by revenue, a title it has held for eight consecutive years. Today, with full-year 2025 revenue of NT$182.5 billion (US$5.8 billion) and over NT$50 billion committed to new factories, Zhen Ding is placing its biggest bet yet: that the AI infrastructure boom will transform its business as profoundly as the smartphone revolution did a generation ago.

Every AI accelerator that powers today’s largest models relies on an advanced substrate to connect the chip to the outside world. These ABF substrates, the high-performance interconnect layers that bridge GPU dies and circuit boards inside advanced packages, can only be manufactured at the required specifications by Japan’s Ibiden and Taiwan’s Unimicron Technology. 

Before the high-bandwidth memory in today’s AI accelerators can function, each chip must be precisely packaged, bonded, and tested to meet exacting specifications. Powertech Technology (PTI), Taiwan’s second-largest outsourced semiconductor assembly and test (OSAT) provider, handles this critical work for many of the world’s leading memory and AI chip makers. As AI infrastructure spending accelerates beyond US$650 billion in annual hyperscaler capital expenditure, Powertech has emerged as both a linchpin of the memory supply chain and a serious contender in advanced AI chip packaging.

ITRI and SAES collaborate on a pilot line for high-vacuum packaging getter tech, boosting sensor lifespan and autonomy in Taiwan’s semiconductor industry.

The AI infrastructure story has mostly been told through the lens of advanced chips and the foundries that produce them. But there is another layer of the supply chain, often overlooked, that determines whether any of these systems actually work. Signals must be transmitted. Power must be delivered across increasingly complex architectures. And the companies solving these high-density interconnect challenges are increasingly headquartered in Taiwan.

The artificial intelligence revolution runs on silicon, but not just any silicon. The processors driving today’s most advanced AI systems demand a level of integration and performance that pushes semiconductor engineering to its limits. At the center of this challenge sits CoWoS (Chip-on-Wafer-on-Substrate), an advanced packaging technology developed by TSMC that has quietly become the essential foundation of AI infrastructure worldwide.

TSMC plans to build nine factories in the U.S. as part of Taiwan’s US$250 billion investment commitment. Explore five key dimensions of this semiconductor expansion.

TSMC Chairman C.C. Wei met with Japan’s Prime Minister to discuss upgrading the Kumamoto fab to 3-nanometer chips. Taiwan retains top tech, ensuring leadership.

TSMC’s new facility in Taichung is driving investment, attracting key suppliers like ASML and Tokyo Electron. The city is solidifying its role in the semiconductor industry.

The Taiwan Stock Exchange surged 571.33 points on Feb. 3, closing at 32,195.36, with TSMC and MediaTek leading gains. Memory stocks struggled, impacting the sector.

National Sun Yat-sen University researchers in Taiwan have developed new proton exchange membranes that double proton conductivity, boosting hydrogen energy and net-zero efforts.

Taiwan extends detention of three ex-TSMC engineers over a tech leak case. They face charges under national security and trade secrets laws, risking long sentences.

Nvidia CEO Jensen Huang concluded his Taiwan visit with a dinner with TSMC executives, expressing optimism for 2026. He clarified Nvidia’s investment plans with OpenAI and discussed the company’s expansion in Taiwan.